Innovative Solutions in Semiconductor Packaging

PART BUNDLES

Our semiconductor products can be purchased individually, or as a bundle. The bundles can include a collection of packages and the associated lid and/or test socket.

Each set below includes only parts that are compatible with that package.

Product Line
Body Size
Lead Count
Lead Pitch
Part Number
QFN
6.0 x 6.0 mm
24
0.65 mm

QFN
6.0 x 6.0 mm
28
0.65 mm

QFN
6.0 x 6.0 mm
36
0.50 mm

QFN
6.0 x 6.0 mm
40
0.50 mm

QFN
6.0 x 6.0 mm
48
0.40 mm

QFN
7.0 x 7.0 mm
28
0.80 mm

QFN
7.0 x 7.0 mm
32
0.65 mm

QFN
7.0 x 7.0 mm
44
0.50 mm

QFN
7.0 x 7.0 mm
48
0.50 mm

QFN
7.0 x 7.0 mm
56
0.40 mm

QFN
7.0 x 7.0 mm
60
0.40 mm

QFN
8.0 x 8.0 mm
28
0.80 mm

QFN
8.0 x 8.0 mm
32
0.80 mm

QFN
8.0 x 8.0 mm
52
0.50 mm

QFN
8.0 x 8.0 mm
56
0.50 mm

QFN
9.0 x 9.0 mm
44
0.65 mm

QFN
9.0 x 9.0 mm
64
0.50 mm

QFN
12.0 x 7.0 mm
28
0.80 mm

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