Innovative Solutions in Semiconductor Packaging

PART BUNDLES

Our semiconductor products can be purchased individually, or as a bundle. The bundles can include a collection of packages and the associated lid and/or test socket.

Each set below includes only parts that are compatible with that package.

Product Line
Body Size
Lead Count
Lead Pitch
Part Number
QFN
12.0 x 12.0 mm
80
0.50 mm
MLP12X12-80-OP-02 – BUNDLED
QFN
12.0 x 12.0 mm
100
0.40 mm
MLP12X12-100-OP-03 – BUNDLED
QFP
10.0 x 10.0 mm
44
0.80 mm
LQFP10X10-44-OP-01 – BUNDLED
QFP
10.0 x 10.0 mm
52
0.65 mm
LQFP10X10-52-OP-01 – BUNDLED
QFP
10.0 x 10.0 mm
64
0.50 mm
LQFP10X10-64-OP-01 – BUNDLED
SOIC
0.195 x 0.150 in
8
0.050 in
SOIC150-08-OP-01 – BUNDLED
SOIC
0.195 x 0.150 in
8
0.050 in
SOIC150-08-OP-01H – BUNDLED
SOIC
0.345 x 0.150 in
14
0.050 in
SOIC150-14-OP-01 – BUNDLED
SOIC
0.345 x 0.150 in
14
0.050 in
SOIC150-14-OP-01H – BUNDLED
SOIC
0.400 x 0.150 in
16
0.050 in
SOIC150-16-OP-01 – BUNDLED
SOIC
0.400 x 0.150 in
16
0.050 in
SOIC150-16-OP-01H – BUNDLED
SOIC
0.400 x 0.150 in
16
0.050 in
SOIC300-16-OP-01 – BUNDLED
SOIC
0.400 x 0.300 in
16
0.050 in
SOIC300-16-OP-01H – BUNDLED
SOIC
0.510 x 0.300 in
20
0.050 in
SOIC300-20-OP-01 – BUNDLED
SOIC
0.510 x 0.300 in
20
0.050 in
SOIC300-20-OP-01H – BUNDLED
SOIC
0.610 x 0.300 in
24
0.050 in
SOIC300-24-OP-01 – BUNDLED
SOIC
0.610 x 0.300 in
24
0.050 in
SOIC300-24-OP-01H – BUNDLED
SOIC
0.710 x 0.300 in
28
0.050 in
SOIC300-28-OP-01 – BUNDLED
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