Innovative Solutions in Semiconductor Packaging

MLP7x7-60-OP-01 - BUNDLED

  • Reset

< Back to Catalog

This bundle shows which lids and sockets are compatible with this base package. You can request a proposal for the entire set: container, lids and sockets using this page.

QFN Bundle

MLP7x7-60-OP-01 - BUNDLED

Lead Count: 60

Body Size: 7.0 x 7.0 mm

Lead Pitch: 0.40 mm

Die Pad Length: 5.200 mm

Die Pad Width: 5.200 mm

Thickness: 0.800 mm

Lead Length: 0.35 mm

Lead Width: 0.20 mm

JDEC SPEC: MO-220

DRAWINGS & DATA SHEETS

To view product drawings and data sheets, you must be logged in. To create an account and have it approved, click here or request a price estimate by adding products to your cart and checking the box to create an account when you complete the submission process.

Product Quantity

MLP7X7-60-OP-01

60 Lead 7mm X 7mm MLP Open-Pak

CL-MLP7X7-15-02

7mm X 7mm MLP Open-Pak Ceramic Lid

CL-MLP7X7-15-02-B

7mm X 7mm MLP Open-Pak Ceramic Lid - Bare

GL-MLP7X7-27-02

7mm X 7mm MLP Open-Pak Glass Lid

GL-MLP7X7-27-02-B

7mm X 7mm MLP Open-Pak Glass Lid - Bare

SK-MLP7X7-XX-01

7mm X 7mm QFN Elastomer Test Socket

Crop Image