Innovative Solutions in Semiconductor Packaging

MLP7X7-28-OP-01 - BUNDLED

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This bundle shows which lids and sockets are compatible with this base package. You can request a proposal for the entire set: container, lids and sockets using this page.

QFN Bundle

MLP7X7-28-OP-01 - BUNDLED

Lead Count: 28

Body Size: 7.0 x 7.0 mm

Lead Pitch: 0.80 mm

Die Pad Length: 5.200 mm

Die Pad Width: 5.200 mm

Lead Length: 0.32 mm

Lead Width: 0.31 mm

JDEC SPEC: MO-220

DRAWINGS & DATA SHEETS

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Product Quantity

MLP7X7-28-OP-01

28 Lead 7mm X 7mm MLP Open-Pak

SK-MLP7X7-XX-01

7mm X 7mm QFN Elastomer Test Socket

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