QFN Bundle
MLP8X8-56-OP-01 - BUNDLED
Lead Count: 56
Body Size: 8.0 x 8.0 mm
Lead Pitch: 0.50 mm
Die Pad Length: 6.040 mm
Die Pad Width: 6.040 mm
Lead Length: 0.32 mm
Lead Width: 0.23 mm
JDEC SPEC: MO-220
DRAWINGS & DATA SHEETS
To view product drawings and data sheets, you must be logged in. To create an account and have it approved, click here or request a price estimate by adding products to your cart and checking the box to create an account when you complete the submission process.