Innovative Solutions in Semiconductor Packaging

MLP9X9-44-OP-01 - BUNDLED

  • Reset

< Back to Catalog

This bundle shows which lids and sockets are compatible with this base package. You can request a proposal for the entire set: container, lids and sockets using this page.

QFN Bundle

MLP9X9-44-OP-01 - BUNDLED

Lead Count: 44

Body Size: 9.0 x 9.0 mm

Lead Pitch: 0.65 mm

Die Pad Length: 6.900 mm

Die Pad Width: 6.900 mm

Lead Length: 0.40 mm

Lead Width: 0.33 mm

JDEC SPEC: MO-220

DRAWINGS & DATA SHEETS

To view product drawings and data sheets, you must be logged in. To create an account and have it approved, click here or request a price estimate by adding products to your cart and checking the box to create an account when you complete the submission process.

Product Quantity

MLP9X9-44-OP-01

44 Lead 9mm X 9mm MLP Open-Pak

CL-MLP9X9-15-01

9mm X 9mm MLP Open-Pak Ceramic Lid

CL-MLP9X9-15-01-B

9mm X 9mm MLP Open-Pak Ceramic Lid - Bare

GL-MLP9X9-27-01

9mm X 9mm MLP Open-Pak Glass Lid

GL-MLP9X9-27-01-B

9mm X 9mm MLP Open-Pak Glass Lid - Bare

PL-MLP9X9-01

9mm X 9mm MLP Open-Pak Plastic Lid

PL-MLP9X9-01-B

9mm X 9mm MLP Open-Pak Plastic Lid - Bare

SK-MLP9X9-XX-01

9mm X 9mm QFN Elastomer Test Socket