Innovative Solutions in Semiconductor Packaging

PART BUNDLES

Our semiconductor products can be purchased individually, or as a bundle. The bundles can include a collection of packages and the associated lid and/or test socket.

Each set below includes only parts that are compatible with that package.

Product Line
Body Size
Lead Count
Lead Pitch
Part Number
QFN
3.0 x 3.0 mm
8
0.65 mm

QFN
3.0 x 3.0 mm
10
0.50 mm

QFN
3.0 x 3.0 mm
12
0.65 mm

QFN
3.0 x 3.0 mm
16
0.50 mm

QFN
4.0 x 4.0 mm
12
0.80 mm

QFN
4.0 x 4.0 mm
12
0.80 mm

QFN
4.0 x 4.0 mm
16
0.65 mm

QFN
4.0 x 4.0 mm
20
0.50 mm

QFN
4.0 x 4.0 mm
24
0.50 mm

QFN
4.0 x 4.0 mm
24
0.50 mm

QFN
5.0 x 5.0 mm
16
0.80 mm

QFN
5.0 x 5.0 mm
20
0.65 mm

QFN
5.0 x 5.0 mm
24
0.65 mm

QFN
5.0 x 5.0 mm
28
0.50 mm

QFN
5.0 x 5.0 mm
32
0.50 mm

QFN
6.0 x 6.0 mm
16
1.00 mm

QFN
6.0 x 6.0 mm
24
0.65 mm

QFN
6.0 x 6.0 mm
28
0.65 mm

1 2 3