Innovative Solutions in Semiconductor Packaging

PART BUNDLES

Our semiconductor products can be purchased individually, or as a bundle. The bundles can include a collection of packages and the associated lid and/or test socket.

Each set below includes only parts that are compatible with that package.

Product Line
Body Size
Lead Count
Lead Pitch
Part Number
SOIC
0.710 x 0.300 in
28
0.050 in

SSOP
0.400 x 0.150 in
16
0.050 in

SSOP
0.195 x 0.150 in
16
0.025 in

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