Innovative Solutions in Semiconductor Packaging


SEMPAC’s Increased Bondability and Reliability in Open Cavity Packages

[10/5/2021]    Bondability and package reliability are key concerns to our customers. Increased package performance is observed with our Hi-Rel plating using a thick deposition of gold. Our process employs application of a generous layer of gold on all our parts to ensure we meet our customers’ performance expectations. Bondability… Read More

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