SOIC Bundle
SOIC300-20-OP-01 - BUNDLED
Lead Count: 20
Body Size: 0.510 x 0.300 in
Lead Pitch: 0.050 in
Die Pad Length: 0.405 in
Die Pad Width: 0.220 in
JDEC SPEC: MS-013
DRAWINGS & DATA SHEETS
To view product drawings and data sheets, you must be logged in. To create an account and have it approved, click here or request a price estimate by adding products to your cart and checking the box to create an account when you complete the submission process.