SOIC Bundle
SOIC300-16-OP-01H - BUNDLED
Lead Count: 16
Body Size: 0.400 x 0.300 in
Lead Pitch: 0.050 in
Die Pad Length: 0.220 in
Die Pad Width: 0.150 in
JDEC SPEC: MO-013
DRAWINGS & DATA SHEETS
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