Innovative Solutions in Semiconductor Packaging

SOIC300-24-OP-01 - BUNDLED

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This bundle shows which lids and sockets are compatible with this base package. You can request a proposal for the entire set: container, lids and sockets using this page.

SOIC Bundle

SOIC300-24-OP-01 - BUNDLED

Lead Count: 24

Body Size: 0.610 x 0.300 in

Lead Pitch: 0.050 in

Die Pad Length: 0.220 in

Die Pad Width: 0.150 in

JDEC SPEC: MS-013

DRAWINGS & DATA SHEETS

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Product Quantity

SOIC300-24-OP-01

24 Lead 300 mils SOIC Open-Pak

CL-270X400-15-01

0.270" X 0.400" Ceramic Lid

CL-270X400-15-01-B

0.270" X 0.400" Ceramic Lid - Bare

GL-270X400-27-01

0.270" X 0.400" Glass Lid

GL-270X400-27-01-B

0.270" X 0.400" Glass Lid - Bare

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