Innovative Solutions in Semiconductor Packaging

DFN3X3-08-OP-01-BUNDLED

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This bundle shows which lids and sockets are compatible with this base package. You can request a proposal for the entire set: container, lids and sockets using this page.

QFN Bundle

DFN3X3-08-OP-01-BUNDLED

Lead Count: 8

Body Size: 3.0 x 3.0 mm

Lead Pitch: 0.65 mm

Die Pad Length: 2.220 mm

Die Pad Width: 1.360 mm

Lead Length: 0.35 mm

Lead Width: 0.30 mm

JDEC SPEC: MO-229

DRAWINGS & DATA SHEETS

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Product Quantity

DFN3X3-08-OP-01

8 Lead 3mm X 3mm DFN Open-Pak

CL-MLP3X3-15-02

3mm X 3mm MLP Open-Pak Ceramic Lid

CL-MLP3X3-15-02-B

3mm X 3mm MLP Open-Pak Ceramic Lid - Bare

GL-MLP3X3-27-02

3mm X 3mm MLP Open-Pak Glass Lid

GL-MLP3X3-27-02-B

3mm X 3mm MLP Open-Pak Glass Lid - Bare

SK-MLP3X3-XX-01

3mm X 3mm QFN Elastomer Test Socket

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