SOIC Package
SOIC300-20-OP-01
20 Lead 300 mils SOIC Open-Pak
Lead Count: 20
Body Size: 0.510 x 0.300 in
Lead Pitch: 0.050 in
Die Pad Length: 0.405 in
Die Pad Width: 0.220 in
Thickness: 0.090 in
JDEC SPEC: MS-013
Tip-To-Tip: 0.405 in
DRAWINGS & DATA SHEETS
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