SEMPAC’s Increased Bondability and Reliability in Open Cavity Packages

[10/5/2021]    Bondability and package reliability are key concerns to our customers. Increased package performance is observed with our Hi-Rel plating using a thick deposition of gold. Our process employs application of a generous layer of gold on all our parts to ensure we meet our customers’ performance expectations.

Bondability and pull strength for both aluminum and gold wire are greatly improved when bonded to gold versus other metals. There is a direct correlation between increased gold thickness and bond strength. SEMPAC has chosen to use a thick, finely textured gold layer for these reasons.

Our Hi-Rel plating process results in at least 35 microinches of gold over nickel, ensuring our parts remain free from corrosion and maintain a pristine bonding surface, regardless the time spent on your shelf. Legacy parts from our archives remain corrosion free.

Gold is expensive. Our team invests significant investments in time, effort, and money into improving our manufacturing process to improve efficiency and to reduce costs to keep our prices competitive while maintaining and improving our quality standards. If you have issues with bondability in your current packaging, SEMPAC has the solution!

SEMPAC’s goal is to ensure every customer receives pristinely fresh packages, well suited to their needs, and manufactured to the highest standards.