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SOIC300-28-OP-01H

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SOIC Package

SOIC300-28-OP-01H

28 Lead 300 mils SOIC Open-Pak (Heat Enhanced)

Lead Count: 28

Body Size: 0.710 x 0.300 in

Lead Pitch: 0.050 in

Die Pad Length: 0.230 in

Die Pad Width: 0.160 in

Thickness: 0.090 in

JDEC SPEC: MS-013

Tip-To-Tip: 0.405 in

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