SOIC Package
SOIC300-28-OP-01H
28 Lead 300 mils SOIC Open-Pak (Heat Enhanced)
Lead Count: 28
Body Size: 0.710 x 0.300 in
Lead Pitch: 0.050 in
Die Pad Length: 0.230 in
Die Pad Width: 0.160 in
Thickness: 0.090 in
JDEC SPEC: MS-013
Tip-To-Tip: 0.405 in
DRAWINGS & DATA SHEETS
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