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SOIC150-16-OP-01H

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SOIC Package

SOIC150-16-OP-01H

16 Lead 150 mils SOIC Open-Pak (Heat Enhanced)

Lead Count: 16

Body Size: 0.400 x 0.150 in

Lead Pitch: 0.050 in

Die Pad Length: 0.120 in

Die Pad Width: 0.075 in

Thickness: 0.054 in

JDEC SPEC: MS-012

Tip-To-Tip: 0.236 in

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