Innovative Solutions in Semiconductor Packaging

MLP4X4-12-OP-01M - BUNDLED

  • Reset

< Back to Catalog

This bundle shows which lids and sockets are compatible with this base package. You can request a proposal for the entire set: container, lids and sockets using this page.

QFN Bundle

MLP4X4-12-OP-01M - BUNDLED

Lead Count: 12

Body Size: 4.0 x 4.0 mm

Lead Pitch: 0.80 mm

Die Pad Length: 2.300 mm

Die Pad Width: 2.300 mm

Lead Length: 0.40 mm

Lead Width: 0.35 mm

JDEC SPEC: MO-220

DRAWINGS & DATA SHEETS

To view product drawings and data sheets, you must be logged in. To create an account and have it approved, click here or request a price estimate by adding products to your cart and checking the box to create an account when you complete the submission process.

Product Quantity

MLP4X4-12-OP-01M

12 Lead 4mm X 4mm MLP Open-Pak (MEMS)

CL-MLP4X4-15-02

4mm X 4mm MLP Open-Pak Ceramic Lid

CL-MLP4X4-15-02-B

4mm X 4mm MLP Open-Pak Ceramic Lid - Bare

GL-MLP4X4-27-02

4mm X 4mm MLP Open-Pak Glass Lid

GL-MLP4X4-27-02-B

4mm X 4mm MLP Open-Pak Glass Lid - Bare

PL-MLP4X4-02

4mm X 4mm MLP Open-Pak Plastic Lid

PL-MLP4X4-02-B

4mm X 4mm MLP Open-Pak Plastic Lid - Bare

SK-MLP4X4-XX-01

4mm X 4mm QFN Elastomer Test Socket