Innovative Solutions in Semiconductor Packaging

PART TYPE - Lid

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Product Line

QFN QFP SOIC SSOP

Body Size

0.185 x 0.145 in 0.195 x 0.150 in 0.300 x 0.150 in 0.345 x 0.150 in 0.370 x 0.270 in 0.400 x 0.150 in 0.400 x 0.270 in 0.400 x 0.300 in 0.510 x 0.300 in 0.610 x 0.300 in 0.710 x 0.300 in 10.0 x 10.0 mm 12.0 x 12.0 mm 12.0 x 7.0 mm 3.0 x 3.0 mm 4.0 x 4.0 mm 5.0 x 5.0 mm 5.0 x 7.0 mm 6.0 x 6.0 mm 7.0 x 7.0 mm 8.0 x 8.0 mm 9.0 x 9.0 mm

Thickness

0.015 in 0.054 in 0.055 in 0.090 in 0.093 in 0.380 mm 0.400 mm 0.700 mm 0.750 mm 0.800 mm 0.953 mm 1.000 mm 1.143 mm

Tip-To-Tip

0.236 in 0.405 in 12.0 mm
Product Line
Body Size
Material
Preform
Part Number
1 2 3 4 … 6

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