Innovative Solutions in Semiconductor Packaging

PART TYPE - JEDEC Tray

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Product Line

QFN QFP SOIC SSOP

Body Size

0.185 x 0.145 in 0.195 x 0.150 in 0.300 x 0.150 in 0.345 x 0.150 in 0.370 x 0.270 in 0.400 x 0.150 in 0.400 x 0.270 in 0.400 x 0.300 in 0.510 x 0.300 in 0.610 x 0.300 in 0.710 x 0.300 in 10.0 x 10.0 mm 12.0 x 12.0 mm 12.0 x 7.0 mm 3.0 x 3.0 mm 4.0 x 4.0 mm 5.0 x 5.0 mm 5.0 x 7.0 mm 6.0 x 6.0 mm 7.0 x 7.0 mm 8.0 x 8.0 mm 9.0 x 9.0 mm

Lead Pitch

0.025 in 0.050 in 0.40 mm 0.50 mm 0.65 mm 0.80 mm 1.00 mm

Lead Count

10 100 12 14 16 20 24 28 32 36 40 44 48 52 56 60 64 8 80

Thickness

0.015 in 0.054 in 0.055 in 0.090 in 0.093 in 0.380 mm 0.400 mm 0.700 mm 0.750 mm 0.800 mm 0.953 mm 1.000 mm 1.143 mm

Tip-To-Tip

0.236 in 0.405 in 12.0 mm
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