Innovative Solutions in Semiconductor Packaging

OPEN CAVITY PACKAGES

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DEVELOPMENT & MANUFACTURING OF OPEN CAVITY QFN PACKAGES FOR SEMICONDUCTORS

SEMPAC, a privately-owned company in the Pacific Northwest / Silicon Forest devoted to the design, development and manufacture of Pre-molded “Open-Cavity” Plastic Packages. SEMPAC exclusively focuses on the development of integrated packaging solutions.

All of the materials used in our manufacturing processes are RoHS and REACH compliant. Our Open-Pak™ packages are molded with green molding compounds, plated with Au/Ni for superior bondability and meet JEDEC outlines.

Our core belief is that by forming lasting partnerships with our customers, both parties’ benefit. By remaining independent and not competing with our partners we are better able to work together to bring innovative packaging solutions to the market.

Our engineers and management team are package, assembly, and material veterans. We are fully aware of the demands made in today’s assembly environment.

Product Type
Product Line
Body Size
Lead Count
Part Number
Package
QFN
3.0 x 3.0 mm
8

Package
QFN
3.0 x 3.0 mm
10

Package
QFN
3.0 x 3.0 mm
12

Package
QFN
3.0 x 3.0 mm
16

Package
QFN
4.0 x 4.0 mm
12

Package
QFN
4.0 x 4.0 mm
12

Package
QFN
4.0 x 4.0 mm
16

Package
QFN
4.0 x 4.0 mm
20

Package
QFN
4.0 x 4.0 mm
24

Package
QFN
4.0 x 4.0 mm
24

Package
QFN
5.0 x 5.0 mm
16

Package
QFN
5.0 x 5.0 mm
20

Package
QFN
5.0 x 5.0 mm
24

Package
QFN
5.0 x 5.0 mm
28

Package
QFN
5.0 x 5.0 mm
32

Package
QFN
5.0 x 7.0 mm
40

Package
QFN
6.0 x 6.0 mm
16

Package
QFN
6.0 x 6.0 mm
24

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