SEMPAC’s line of QFP products (Quad Flat Pack) are offered in various pre-molded Open Cavity package configurations. Please refer to our Open-Tooling Catalog for a solution to your requirements.
Our Open-Pak™ IC packages are gold plated to military standards to insure reliable wire bonds and strong durable die adhesion. All Open-Pak™ QFP packages meet JEDEC standard outlines and footprints and are designed with tie-bars to eliminate co-planarity issues, at all -4- corners. For applications that require higher frequency applications, SEMPAC offers a “heat enhanced” version on all our QFP packages.
As with all of the family of packages offered by SEMPAC, a full line of epoxy coated, or non- coated ceramic or glass lids are available thus providing our customers with the sealing capability of their choice. Optional surface finishes are also available which include; Nickel Palladium ( Ni/Pd ) and Nickel, Palladium, Gold ( Ni, Pd, Au ) both of which are proven surface finishes for successful wire bonding.
SEMPAC’s Open-Pak™ technology is widely becoming the packaging solution by many engineers as the ideal, cost effective alternative for device development and die qualifications.
If you have a specific application that requires customization, SEMPAC offers the lowest cycle time and NRE’s (non-recurring engineering) cost when designing a customer’s package.
Please contact our sales department to discuss your application or request a quote on one of the items from our product configuration list below:
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| Body Width | Lead Count | Die Pad Size | Lead Pitch | Body Thickness | JEDEC Spec | |
|---|---|---|---|---|---|---|
| 10X10 mm | 44 | 6.86 SQ mm | .80 mm | 1.14 mm | MS-026 | |
| Package Drawing LQFP 10X10-44-OP-01 |
Bonding Drawing LQFP 10X10-44-OP-01-B |
Ceramic Lid Part No. CL-LQFP 10X10-15-01 | Request Quote | |||
| 10X10 mm | 52 | 6.86 SQ mm | .65 mm | 1.14 mm | MS-026 | |
| Package Drawing LQFP 10X10-52-OP-01 |
Bonding Drawing LQFP 10X10-52-OP-01-B |
Ceramic Lid Part No. CL-LQFP 10X10-15-01 | Request Quote | |||
| 10X10 mm | 64 | 6.86 SQ mm | 0.5 mm | 1.14 mm | MS-026 | |
| Package Drawing LQFP10X10-64-OP-01 |
Bonding Drawing LQFP10X10-64-OP-01-B |
Ceramic Lid Part No. CL-LQFP10X10-15-01 | Request Quote | |||


