SEMPAC Inc. Innovative Solutions In Packaging
Open-Pak™ Products :: QFN
SEMPAC’S QFN (Quad Flat No-Lead) “air-cavity” package are designed with specially formulated molding compounds, gold plated copper alloy leadframes and are compact in size but offer high performance. Our “Open-Pak”™ Technology has become a popular choice with packaging and design engineers for its reliability, heat dissipation and high power capability.
SEMPAC’s QFN/ MLP Packages are available in a variety of configurations from 3X3 thru 12X12 body sizes all with a standard lead pitch of 0.50mm and are offered with multiple pin counts.
Custom leadframe & molding for new package designs are available. Our team of engineers would be happy to assist you in the development on any of your conceptual ideas with our “solutions” for packaging.
Please contact our sales department to discuss your application or request a quote on one of the items from our product configuration list below:
Open-Pak™ QFN / MLP Product Configuration List
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| Body Width | Lead Count | Die Pad Size | Lead Pitch | Body Thickness | JEDEC Spec | |
|---|---|---|---|---|---|---|
| 5X5 mm | 16 | 3.10 SQ mm | 0.80 mm | 0.80 mm | MO-220 | |
| Package Drawing MLP5X5-16-OP-02 |
Bonding Drawing MLP5X5-16-OP-02-B |
Ceramic Lid Part No. CL-MLP5X5-15-02 | Request Quote | |||
| 5X5 mm | 20 | 3.30 SQ mm | 0.65 mm | 0.80 mm | MO-220 | |
| Package Drawing MLP5X5-20-OP-01 |
Bonding Drawing MLP5X5-20-OP-01-B |
Ceramic Lid Part No. CL-MLP5X5-15-02 | Request Quote | |||
| 5X5 mm | 24 | 3.10 SQ mm | 0.65 mm | 0.80 mm | MO-220 | |
| Package Drawing MLP5X5-24-OP-01 |
Bonding Drawing MLP5X5-24-OP-01-B |
Ceramic Lid Part No. CL-MLP5X5-15-02 | Request Quote | |||
| 5X5 mm | 28 | 3.30 SQ mm | 0.50 mm | 0.80 mm | MO-220 | |
| Package Drawing MLP5X5-28-OP-01 |
Bonding Drawing MLP5X5-28-OP-01-B |
Ceramic Lid Part No. CL-MLP5X5-15-02 | Request Quote | |||
