SEMPAC Inc. - Open-Pak™ Innovative Solutions In Packaging


SEMPAC Inc. Innovative Solutions In Packaging


 

Open-Pak™ Products :: QFN

SEMPAC’S QFN (Quad Flat No-Lead) “air-cavity” package are designed with specially formulated molding compounds, gold plated copper alloy leadframes and are compact in size but offer high performance. Our “Open-Pak”™ Technology has become a popular choice with packaging and design engineers for its reliability, heat dissipation and high power capability.

SEMPAC’s QFN/ MLP Packages are available in a variety of configurations from 3X3 thru 12X12 body sizes all with a standard lead pitch of 0.50mm and are offered with multiple pin counts.

Custom leadframe & molding for new package designs are available. Our team of engineers would be happy to assist you in the development on any of your conceptual ideas with our “solutions” for packaging.

Please contact our sales department to discuss your application or request a quote on one of the items from our product configuration list below:

Open-Pak™ QFN / MLP Product Configuration List

Showing page 2 of 8

Body Width Lead Count Die Pad Size Lead Pitch Body Thickness JEDEC Spec  
4X4 mm 12 2.30 SQ mm 0.80 mm 0.80 mm MO-220  
Package Drawing
MLP4X4-12-OP-01
Bonding Drawing
MLP4X4-12-OP-01-B
Ceramic Lid Part No.
CL-MLP4X4-15-01
Request Quote
4X4 mm 16 2.30 SQ mm 0.65 mm 0.80 mm MO-220  
Package Drawing
MLP4X4-16-OP-01
Bonding Drawing
MLP4X4-16-OP-01-B
Ceramic Lid Part No.
CL-MLP4X4-15-01
Request Quote
4X4 mm 20 2.30 SQ mm 0.50 mm 0.80 mm MO-220  
Package Drawing
MLP4X4-20-OP-01
Bonding Drawing
MLP4X4-20-OP-01-B
Ceramic Lid Part No.
CL-MLP4X4-15-01
Request Quote
4X4 mm 24 2.30 SQ mm 0.50 mm 0.80 mm MO-220  
Package Drawing
MLP4X4-24-OP-01
Bonding Drawing
MLP4X4-24-OP-01-B
Ceramic Lid Part No.
CL-MLP4X4-15-01
Request Quote

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